SOKA TECHNOLOGY
Silicon wafer Dry Method Oxide Layer P/N Type Semiconductor Substrate
Specification:3inch P(100) 0.001~0.009Ω Oxide Layer 200nm
Quantity:25 Pieces
Quantity:
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Specification:3inch P(100) 0.001~0.009Ω Oxide Layer 200nm
Quantity:25 Pieces
Quantity:
Specification:3inch P(100) 0.001~0.009Ω Oxide Layer 200nm
Quantity:25 Pieces
Quantity:
♦️High-quality silicon wafer for Research and Experiment.
♦️Provide small quantities, special specifications products, and customized services.
♦️Global shipping, secure payment, large inventory.
♦️Minimum delivery time within 1 week. Shipped by FedEx, DHL,UPS, etc.
Silicon Wafer Specification:
- Size: 4inch;
- Method: CZ;
- Type: P;
- Dopant: B;
- Orientation:100;
- Resistivity: 1~10Ω;
- Thickness: 525um±25;
- Oxide film: 280/300/500nm (both sides);
- TTV<10um ;
- Surface: polished;
- Backside: etched;
- Packing: silicon wafer case ;
