Silicon wafer 6inch P/N Type(100) 0.01~0.05Ω Oxide Layer Semiconductor Substrate
♦️ High-quality silicon wafer for Research and Experiment.
♦️ Provide small quantities, special specifications products, and customized services.
♦️Global shipping, secure payment, large inventory.
♦️Minimum delivery time within 1 week. Shipped by FedEx, DHL,UPS, etc.
Silicon Wafer Specification:
-
Size: 6inch;
-
Method: CZ;
-
Type: P;
-
Dopant: B;
-
Orientation: 100;
-
Resistivity: 0.01~0.05Ω·cm;
-
Thickness: 625um±25;
-
Oxide layer: 280nm (both sides);
-
TTV<15um ;
-
Surface: polished;
-
Backside: etched;
-
Packing: silicon wafer case;
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♦️ High-quality silicon wafer for Research and Experiment.
♦️ Provide small quantities, special specifications products, and customized services.
♦️Global shipping, secure payment, large inventory.
♦️Minimum delivery time within 1 week. Shipped by FedEx, DHL,UPS, etc.
Silicon Wafer Specification:
-
Size: 6inch;
-
Method: CZ;
-
Type: P;
-
Dopant: B;
-
Orientation: 100;
-
Resistivity: 0.01~0.05Ω·cm;
-
Thickness: 625um±25;
-
Oxide layer: 280nm (both sides);
-
TTV<15um ;
-
Surface: polished;
-
Backside: etched;
-
Packing: silicon wafer case;
♦️ High-quality silicon wafer for Research and Experiment.
♦️ Provide small quantities, special specifications products, and customized services.
♦️Global shipping, secure payment, large inventory.
♦️Minimum delivery time within 1 week. Shipped by FedEx, DHL,UPS, etc.
Silicon Wafer Specification:
-
Size: 6inch;
-
Method: CZ;
-
Type: P;
-
Dopant: B;
-
Orientation: 100;
-
Resistivity: 0.01~0.05Ω·cm;
-
Thickness: 625um±25;
-
Oxide layer: 280nm (both sides);
-
TTV<15um ;
-
Surface: polished;
-
Backside: etched;
-
Packing: silicon wafer case;
♦️ High-quality silicon wafer for Research and Experiment.
♦️ Provide small quantities, special specifications products, and customized services.
♦️Global shipping, secure payment, large inventory.
♦️Minimum delivery time within 1 week. Shipped by FedEx, DHL,UPS, etc.
Silicon Wafer Specification:
- Size: 6inch;
- Method: CZ;
- Type: N;
- Dopant: Sb;
- Orientation: 100;
- Resistivity: 0.01~0.02Ω·cm;
- Thickness: 625um±25;
- Oxide layer: 280nm (both sides);
- TTV<10um ;
- Surface: polished;
- Backside: etched;
- Packing: silicon wafer case;
