SOKA TECHNOLOGY
Diced Silicon wafer 10mm×10mm Semiconductor Chip for SEM AMF Optics
Specification:P(111)<0.02Ω 525um SSP
Quantity:20 Pieces
Quantity:
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Specification:P(111)<0.02Ω 525um SSP
Quantity:20 Pieces
Quantity:
Specification:P(111)<0.02Ω 525um SSP
Quantity:20 Pieces
Quantity:
♦️ High-quality silicon wafer for Research and Experiment.
♦️ Provide small quantities, special specifications products, and customized services.
♦️Global shipping, secure payment, large inventory.
♦️Minimum delivery time within 1 week. Shipped by FedEx, DHL,UPS, etc.
Silicon Wafer Specification:
- Method: CZ;
- Type: N-Type;
- Dopant: Sb;
- Orientation: 100/111;
- Resistivity: 0.01~0.02Ω/0.002~0.004Ω;
- Thickness: 525um±25/625um±25;
- Front side: polished;
- Backside: etched;
- Packing: silicon wafer case;
