

Lithium Niobate Substrate 8inch DSP SAW Acoustic Grade LN LiNbO3 Wafer
Thickness:0.5mm
Cut:Y-cut 128º
Quantity:5 Pieces
数量:
♦️High-quality LN wafer for Research and Experiment.
♦️Provide small quantities, special specifications products, and customized services
♦️Global shipping, secure payment, large inventory.
♦️Minimum delivery time within 1 week. Shipped by FedEx, DHL,UPS, etc.
LiNbO3(LN) Substrate Specification:
-
Size: 8inch;
-
Method: CZ;
-
Diameter: 200 ± 0.5mm;
-
Thickness: 0.5mm ± 25um;
-
Orientation: 128º Y-cut;
-
Notch;
-
TTV<10um;
-
Front side: polished;
-
Backside: polished;
-
Packing: Wafer case;
选择方案
Thickness:0.5mm
Cut:Y-cut 128º
Quantity:5 Pieces
数量:
♦️High-quality LN wafer for Research and Experiment.
♦️Provide small quantities, special specifications products, and customized services
♦️Global shipping, secure payment, large inventory.
♦️Minimum delivery time within 1 week. Shipped by FedEx, DHL,UPS, etc.
LiNbO3(LN) Substrate Specification:
-
Size: 8inch;
-
Method: CZ;
-
Diameter: 200 ± 0.5mm;
-
Thickness: 0.5mm ± 25um;
-
Orientation: 128º Y-cut;
-
Notch;
-
TTV<10um;
-
Front side: polished;
-
Backside: polished;
-
Packing: Wafer case;
Thickness:0.5mm
Cut:Y-cut 128º
Quantity:5 Pieces
数量:
♦️High-quality LN wafer for Research and Experiment.
♦️Provide small quantities, special specifications products, and customized services
♦️Global shipping, secure payment, large inventory.
♦️Minimum delivery time within 1 week. Shipped by FedEx, DHL,UPS, etc.
LiNbO3(LN) Substrate Specification:
-
Size: 8inch;
-
Method: CZ;
-
Diameter: 200 ± 0.5mm;
-
Thickness: 0.5mm ± 25um;
-
Orientation: 128º Y-cut;
-
Notch;
-
TTV<10um;
-
Front side: polished;
-
Backside: polished;
-
Packing: Wafer case;
♦️High-quality LN wafer for Research and Experiment.
♦️Provide small quantities, special specifications products, and customized services
♦️Global shipping, secure payment, large inventory.
♦️Minimum delivery time within 1 week. Shipped by FedEx, DHL,UPS, etc.
LiNbO3(LN) Substrate Specification:
- Size: 8inch;
- Method: CZ;
- Diameter: 200 ± 0.5mm;
- Thickness: 500um ± 25;
- Orientation: 128º Y-cut;
- TTV<10um;
- Front side: polished;
- Backside: polished;
- Packing: Wafer case + clean pack;
