
Glass Wafer B270i 2~12inch Double Side Polished Substrate
♦️High-quality B270i wafer for Research and Experiment.
♦️Provide small quantities, special specifications products, and customized services
♦️Global shipping, secure payment, large inventory.
♦️Minimum delivery time within 1 week. Shipped by FedEx,DHL,UPS, etc.
Glass Wafer Specification:
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Material: B270i ;
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Size: 2inch ;
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Diameter: 50mm±0.2;
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Thickness: 1mm±0.02;
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Flat: 17.5mm±2.5;
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Front side: Polished ;
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Backside: Polished;
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Packing: Wafer case ;
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Production time: 2~3weeks ;
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♦️High-quality B270i wafer for Research and Experiment.
♦️Provide small quantities, special specifications products, and customized services
♦️Global shipping, secure payment, large inventory.
♦️Minimum delivery time within 1 week. Shipped by FedEx,DHL,UPS, etc.
Glass Wafer Specification:
-
Material: B270i ;
-
Size: 2inch ;
-
Diameter: 50mm±0.2;
-
Thickness: 1mm±0.02;
-
Flat: 17.5mm±2.5;
-
Front side: Polished ;
-
Backside: Polished;
-
Packing: Wafer case ;
-
Production time: 2~3weeks ;
♦️High-quality B270i wafer for Research and Experiment.
♦️Provide small quantities, special specifications products, and customized services
♦️Global shipping, secure payment, large inventory.
♦️Minimum delivery time within 1 week. Shipped by FedEx,DHL,UPS, etc.
Glass Wafer Specification:
-
Material: B270i ;
-
Size: 2inch ;
-
Diameter: 50mm±0.2;
-
Thickness: 1mm±0.02;
-
Flat: 17.5mm±2.5;
-
Front side: Polished ;
-
Backside: Polished;
-
Packing: Wafer case ;
-
Production time: 2~3weeks ;
♦️High-quality Quartz wafer for Research and Experiment.
♦️Provide small quantities, special specifications products, and customized services
♦️Global shipping, secure payment, large inventory.
♦️Minimum delivery time within 1 week. Shipped by FedEx, DHL,UPS, etc.
Quartz Wafer Specification:
- Material: Synthetic quartz
- Size: 6inch ;
- Diameter: 150.1 ± 0.3mm;
- Thickness: 0.5mm ± 0.05mm or 1mm ± 0.05mm;
- OF: 47.5mm ± 2mm;
- TTV<10um;
- BOW<30um;
- WRAP<40um;
- Refractive Index(@632.8nm):1.45680±0.0002
- Front side: Polished ;
- Backside: Polished;
- Packing: Wafer case ;
