AIN Wafer Aluminum nitride Mono Semiconductor Substrate - Soka Technology
Aluminum nitride wafer 1~2inch AIN mono high pure semiconductor substrate - Soka Technology

AIN Wafer Aluminum nitride Mono Semiconductor Substrate

$2,675.00
Size:10x10mm
Quantity:
♦️ High-quality AIN Wafer for Research and Experiment.
♦️ Provide small quantities, special specifications products, and customized services.
♦️Global shipping, secure payment, large inventory.
♦️Minimum delivery time within 1 week. Shipped by FedEx, DHL,UPS, etc.
AIN Wafer Specification:  
  •     Size: 10x10mm士0.5;
  •     Crystal type:2H;
  •     Orientation: {0001}士0.5°;
  •     Thickness: 650um士50;
  •     FWHM-HRXRD@(0002)(arcsec): ≤300;
  •     FWHM-HRXRD@(10-12)(arcsec): ≤200;
  •     Absorption Coefficient@265nm:≤70(cm-1)
  •     Surface roughness (Ra):Al face: ≤0.5nm,N face: ≤1.2um;
  •     Edge Exclusion:0.5mm;
  •     Scratches:None;
  •     Edge Chips:None;
  •     Usable Area:>90%；
  •     TTV≤30um;
  •     Bow≤30um;
  •     Wapr≤30um;
  •     Cracks:None, by naked eye;
  •     Holes:None, by naked eye;
  •     Surface Contamination : None, by naked eye, diffuse light;
  •     Packing: Single wafer case;


 
♦️ High-quality silicon wafer for Research and Experiment.
♦️ Provide small quantities, special specifications products, and customized services.
♦️Global shipping, secure payment, large inventory.
♦️Minimum delivery time within 1 week. Shipped by FedEx, DHL,UPS, etc.
Silicon Wafer Specification:
  • Diameter: 25.4mm士0.5;
  • Crystal type:2H
  • Orientation: {0001}士0.5°;
  • Thickness: 700um±50;
  • FWHM-HRXRD@(0002)(arcsec): ≤500;
  • FWHM-HRXRD@(10-12)(arcsec): ≤400;
  • AbsorptionCoefficient@265nm:≤100(cm-1)
  • Surface roughness (Ra):Al face: ≤0.5nm,N face: s≤1.2um;
  • Edge Exclusion:1mm;
  • Scratches:None;
  • Edge Chips:≤3,cumulative length<1mm;
  • Usable Area:>70%；
  • Primary flat orientation:{10-10}士5.0°;
  • Secondary flat orientation:90°+5 CW from Primary Flat, as viewed from Al face,90°+5 CCW from Primary Flat, as viewed firom N face;
  • TTV≤30um;
  • Bow≤30um;
  • Wapr≤30um;
  • Cracks:on the edge, <2mm each;
  • Holes:2 allowed, <0.5mm each;
  • Surface Finish: Al face: CMP, N face: MP;
  • Packing: silicon wafer case;