

Solar Wafer N Type G12 210x210mm Monocrystalline substrate
♦️High Conversion Efficiency Solar Silicon Wafer.
♦️According to demand, we can provide custom-made service.
♦️Global shipping, secure payment, large inventory.
♦️Minimum delivery time within 1 week. Shipped by FedEx, DHL,UPS, etc.
Solar wafer Specification:
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N Type G12 Solar wafer
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Method: CZ;
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Fillet diameter: 295mm±0.25;
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Dopant: Phosphorus;
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Orientation: <100> ±3°;
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Oxygen concentration: ≤ 1.0ppma;
-
Carbon concentration: ≤12ppms;
-
Right angle: 90±0.2°
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Resistivity: 0.3-2.1Ω;
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Lifetime:≧1000 uses(QSSPC);
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Thickness: 120um±20;
-
TTV<30um ;
-
Saw mark: ≤15um ;
-
Warp: ≤50um;
-
Bow: ≤50um;
-
Edge Chip: 0.5x0.3mm less than two;
-
Corner length: 8~9mm ;
-
Etch Pit Density: ≤500cm-2;
Configurer
♦️High Conversion Efficiency Solar Silicon Wafer.
♦️According to demand, we can provide custom-made service.
♦️Global shipping, secure payment, large inventory.
♦️Minimum delivery time within 1 week. Shipped by FedEx, DHL,UPS, etc.
Solar wafer Specification:
-
N Type G12 Solar wafer
-
Method: CZ;
-
Fillet diameter: 295mm±0.25;
-
Dopant: Phosphorus;
-
Orientation: <100> ±3°;
-
Oxygen concentration: ≤ 1.0ppma;
-
Carbon concentration: ≤12ppms;
-
Right angle: 90±0.2°
-
Resistivity: 0.3-2.1Ω;
-
Lifetime:≧1000 uses(QSSPC);
-
Thickness: 120um±20;
-
TTV<30um ;
-
Saw mark: ≤15um ;
-
Warp: ≤50um;
-
Bow: ≤50um;
-
Edge Chip: 0.5x0.3mm less than two;
-
Corner length: 8~9mm ;
-
Etch Pit Density: ≤500cm-2;
♦️High Conversion Efficiency Solar Silicon Wafer.
♦️According to demand, we can provide custom-made service.
♦️Global shipping, secure payment, large inventory.
♦️Minimum delivery time within 1 week. Shipped by FedEx, DHL,UPS, etc.
Solar wafer Specification:
-
N Type G12 Solar wafer
-
Method: CZ;
-
Fillet diameter: 295mm±0.25;
-
Dopant: Phosphorus;
-
Orientation: <100> ±3°;
-
Oxygen concentration: ≤ 1.0ppma;
-
Carbon concentration: ≤12ppms;
-
Right angle: 90±0.2°
-
Resistivity: 0.3-2.1Ω;
-
Lifetime:≧1000 uses(QSSPC);
-
Thickness: 120um±20;
-
TTV<30um ;
-
Saw mark: ≤15um ;
-
Warp: ≤50um;
-
Bow: ≤50um;
-
Edge Chip: 0.5x0.3mm less than two;
-
Corner length: 8~9mm ;
-
Etch Pit Density: ≤500cm-2;
