Silicon Wafer 8inch P-type 1-100Ω Oxide Layer Semiconductor Substrate
♦️ High-quality silicon wafer for Research and Experiment.
♦️ Provide small quantities, special specifications products, and customized services.
♦️Global shipping, secure payment, large inventory.
♦️Minimum delivery time within 1 week. Shipped by FedEx, DHL,UPS, etc.
Silicon Wafer Specification:
-
Size: 8inch;
-
Method: CZ;
-
Type: P;
-
Dopant: B;
-
Orientation:100;
-
Resistivity:1~100Ω;
-
Thickness: 725um±25;
-
Oxide layer: 100nm±5% (both sides);
-
Surface: polished;
-
Backside: etched;
-
Packing: silicon wafer case;
Configurer
♦️ High-quality silicon wafer for Research and Experiment.
♦️ Provide small quantities, special specifications products, and customized services.
♦️Global shipping, secure payment, large inventory.
♦️Minimum delivery time within 1 week. Shipped by FedEx, DHL,UPS, etc.
Silicon Wafer Specification:
-
Size: 8inch;
-
Method: CZ;
-
Type: P;
-
Dopant: B;
-
Orientation:100;
-
Resistivity:1~100Ω;
-
Thickness: 725um±25;
-
Oxide layer: 100nm±5% (both sides);
-
Surface: polished;
-
Backside: etched;
-
Packing: silicon wafer case;
♦️ High-quality silicon wafer for Research and Experiment.
♦️ Provide small quantities, special specifications products, and customized services.
♦️Global shipping, secure payment, large inventory.
♦️Minimum delivery time within 1 week. Shipped by FedEx, DHL,UPS, etc.
Silicon Wafer Specification:
-
Size: 8inch;
-
Method: CZ;
-
Type: P;
-
Dopant: B;
-
Orientation:100;
-
Resistivity:1~100Ω;
-
Thickness: 725um±25;
-
Oxide layer: 100nm±5% (both sides);
-
Surface: polished;
-
Backside: etched;
-
Packing: silicon wafer case;
♦️ High-quality silicon wafer for Research and Experiment.
♦️ Provide small quantities, special specifications products, and customized services.
♦️Global shipping, secure payment, large inventory.
♦️Minimum delivery time within 1 week. Shipped by FedEx, DHL,UPS, etc.
Silicon Wafer Specification:
- Size: 8inch;
- Method: CZ;
- Type: P;
- Dopant: B;
- Orientation:100;
- Resistivity: 1~100Ω;
- Thickness: 725um±25;
- Oxide film: 100nm (both sides);
- Surface: polished;
- Backside: etched;
- Packing: silicon wafer case;
