Silicon wafer 3inch P/N Type 1~10Ω Oxide Layer Semiconductor Substrate
♦️High-quality silicon wafer for Research and Experiment.
♦️Provide small quantities, special specifications products, and customized services.
♦️Global shipping, secure payment, large inventory.
♦️Minimum delivery time within 1 week. Shipped by FedEx, DHL,UPS, etc.
Silicon Wafer Specification:
-
Size: 3inch;
-
Method: CZ;
-
Type: P;
-
Dopant: B;
-
Orientation:100;
-
Resistivity: 1~10Ω;
-
Thickness:380um±25;
-
Oxide layer: 300nm(both sides);
-
TTV<10um ;
-
Surface: polished;
-
Backside: etched;
-
Packing: silicon wafer case;
Configurer
♦️High-quality silicon wafer for Research and Experiment.
♦️Provide small quantities, special specifications products, and customized services.
♦️Global shipping, secure payment, large inventory.
♦️Minimum delivery time within 1 week. Shipped by FedEx, DHL,UPS, etc.
Silicon Wafer Specification:
-
Size: 3inch;
-
Method: CZ;
-
Type: P;
-
Dopant: B;
-
Orientation:100;
-
Resistivity: 1~10Ω;
-
Thickness:380um±25;
-
Oxide layer: 300nm(both sides);
-
TTV<10um ;
-
Surface: polished;
-
Backside: etched;
-
Packing: silicon wafer case;
♦️High-quality silicon wafer for Research and Experiment.
♦️Provide small quantities, special specifications products, and customized services.
♦️Global shipping, secure payment, large inventory.
♦️Minimum delivery time within 1 week. Shipped by FedEx, DHL,UPS, etc.
Silicon Wafer Specification:
-
Size: 3inch;
-
Method: CZ;
-
Type: P;
-
Dopant: B;
-
Orientation:100;
-
Resistivity: 1~10Ω;
-
Thickness:380um±25;
-
Oxide layer: 300nm(both sides);
-
TTV<10um ;
-
Surface: polished;
-
Backside: etched;
-
Packing: silicon wafer case;
♦️High-quality silicon wafer for Research and Experiment.
♦️Provide small quantities, special specifications products, and customized services.
♦️Global shipping, secure payment, large inventory.
♦️Minimum delivery time within 1 week. Shipped by FedEx, DHL,UPS, etc.
Silicon Wafer Specification:
- Size: 3inch;
- Method: CZ;
- Type: N;
- Dopant: P;
- Orientation:100;
- Resistivity: 1~10Ω;
- Thickness: 500um±25;
- Oxide layer: 100nm(both sides);
- TTV<10um ;
- Surface: polished;
- Backside: etched;
- Packing: silicon wafer case;
