Silicon wafer 6inch P Type(100/111) Single/Double Side Polished Semiconductor Substrate
♦️ High-quality silicon wafer for Research and Experiment.
♦️ Provide small quantities, special specifications products, and customized services.
♦️Global shipping, secure payment, large inventory.
♦️Minimum delivery time within 1 week. Shipped by FedEx, DHL,UPS, etc.
Silicon Wafer Specification:
-
Method: CZ;
-
Size: 6inch;
-
Type: P-Type ;
-
Dopant: B;
-
Orientation: 100;
-
Resistivity: 0.001~0.009Ω;
-
Thickness: 625um±25;
-
TTV<15um ;
-
Front side: polished;
-
Back side: etched;
-
Packing: silicon wafer case ;
Configurer
♦️ High-quality silicon wafer for Research and Experiment.
♦️ Provide small quantities, special specifications products, and customized services.
♦️Global shipping, secure payment, large inventory.
♦️Minimum delivery time within 1 week. Shipped by FedEx, DHL,UPS, etc.
Silicon Wafer Specification:
-
Method: CZ;
-
Size: 6inch;
-
Type: P-Type ;
-
Dopant: B;
-
Orientation: 100;
-
Resistivity: 0.001~0.009Ω;
-
Thickness: 625um±25;
-
TTV<15um ;
-
Front side: polished;
-
Back side: etched;
-
Packing: silicon wafer case ;
♦️ High-quality silicon wafer for Research and Experiment.
♦️ Provide small quantities, special specifications products, and customized services.
♦️Global shipping, secure payment, large inventory.
♦️Minimum delivery time within 1 week. Shipped by FedEx, DHL,UPS, etc.
Silicon Wafer Specification:
-
Method: CZ;
-
Size: 6inch;
-
Type: P-Type ;
-
Dopant: B;
-
Orientation: 100;
-
Resistivity: 0.001~0.009Ω;
-
Thickness: 625um±25;
-
TTV<15um ;
-
Front side: polished;
-
Back side: etched;
-
Packing: silicon wafer case ;
♦️ High-quality silicon wafer for Research and Experiment.
♦️ Provide small quantities, special specifications products, and customized services.
♦️Global shipping, secure payment, large inventory.
♦️Minimum delivery time within 1 week. Shipped by FedEx, DHL,UPS, etc.
Silicon Wafer Specification:
- Method: CZ;
- Size: 6inch;
- Type: P-Type ;
- Dopant: B;
- Orientation: 100;
- Resistivity: 0.001~0.005Ω;
- Thickness: 625um±25;
- TTV<15um ;
- Front side: polished;
- Back side: etched;
- Packing: silicon wafer case ;
