Silicon wafer 4inch P Type(100) Single/Double Side Polished Semiconductor Substrate
♦️ High-quality silicon wafer for Research and Experiment.
♦️ Provide small quantities, special specifications products, and customized services.
♦️Global shipping, secure payment, large inventory.
♦️Minimum delivery time within 1 week. Shipped by FedEx, DHL,UPS, etc.
Silicon Wafer Specification:
-
Size: 4inch;
-
Method: CZ;
-
Orientation: 100;
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Type: P-Type;
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Dopant: B;
-
Resistivity:0.001~0.005Ω;
-
Thickness: 525um±25;
-
TTV<10um ;
-
Front side: polished;
-
Back side: etched;
-
Packing: silicon wafer case;
Configurer
♦️ High-quality silicon wafer for Research and Experiment.
♦️ Provide small quantities, special specifications products, and customized services.
♦️Global shipping, secure payment, large inventory.
♦️Minimum delivery time within 1 week. Shipped by FedEx, DHL,UPS, etc.
Silicon Wafer Specification:
-
Size: 4inch;
-
Method: CZ;
-
Orientation: 100;
-
Type: P-Type;
-
Dopant: B;
-
Resistivity:0.001~0.005Ω;
-
Thickness: 525um±25;
-
TTV<10um ;
-
Front side: polished;
-
Back side: etched;
-
Packing: silicon wafer case;
♦️ High-quality silicon wafer for Research and Experiment.
♦️ Provide small quantities, special specifications products, and customized services.
♦️Global shipping, secure payment, large inventory.
♦️Minimum delivery time within 1 week. Shipped by FedEx, DHL,UPS, etc.
Silicon Wafer Specification:
-
Size: 4inch;
-
Method: CZ;
-
Orientation: 100;
-
Type: P-Type;
-
Dopant: B;
-
Resistivity:0.001~0.005Ω;
-
Thickness: 525um±25;
-
TTV<10um ;
-
Front side: polished;
-
Back side: etched;
-
Packing: silicon wafer case;
♦️ High-quality silicon wafer for Research and Experiment.
♦️ Provide small quantities, special specifications products, and customized services.
♦️Global shipping, secure payment, large inventory.
♦️Minimum delivery time within 1 week. Shipped by FedEx, DHL,UPS, etc.
Silicon Wafer Specification:
- Size: 4inch;
- Method: CZ;
- Orientation: 100/111;
- Type: N-Type;
- Dopant: As;
- Resistivity: 0.002~0.004Ω;
- Thickness: 525um±25;
- TTV<10um ;
- Front side: polished;
- Back side: etched;
-
Packing: silicon wafer case;
