Silicon wafer 4inch N Type(100) <0.02Ω Gold Layer 100nm Semiconductor Substrate
♦️ High-quality silicon wafer for Research and Experiment.
♦️ Provide small quantities, special specifications products, and customized services.
♦️Global shipping, secure payment, large inventory.
♦️Minimum delivery time within 1 week. Shipped by FedEx, DHL,UPS, etc.
Silicon Wafer Specification:
-
Size: 4inch;
-
Method: CZ;
-
Type: N;
-
Dopant: P;
-
Orientation:100;
-
Resistivity: <0.02Ω;
-
Thickness: 500um±25;
-
TTV<10um ;
-
Surface: polished;
-
Backside: etched;
-
Gold film: 100nm (cr30nm;Au 100nm);
-
Packing: silicon wafer case;
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♦️ High-quality silicon wafer for Research and Experiment.
♦️ Provide small quantities, special specifications products, and customized services.
♦️Global shipping, secure payment, large inventory.
♦️Minimum delivery time within 1 week. Shipped by FedEx, DHL,UPS, etc.
Silicon Wafer Specification:
-
Size: 4inch;
-
Method: CZ;
-
Type: N;
-
Dopant: P;
-
Orientation:100;
-
Resistivity: <0.02Ω;
-
Thickness: 500um±25;
-
TTV<10um ;
-
Surface: polished;
-
Backside: etched;
-
Gold film: 100nm (cr30nm;Au 100nm);
-
Packing: silicon wafer case;
♦️ High-quality silicon wafer for Research and Experiment.
♦️ Provide small quantities, special specifications products, and customized services.
♦️Global shipping, secure payment, large inventory.
♦️Minimum delivery time within 1 week. Shipped by FedEx, DHL,UPS, etc.
Silicon Wafer Specification:
-
Size: 4inch;
-
Method: CZ;
-
Type: N;
-
Dopant: P;
-
Orientation:100;
-
Resistivity: <0.02Ω;
-
Thickness: 500um±25;
-
TTV<10um ;
-
Surface: polished;
-
Backside: etched;
-
Gold film: 100nm (cr30nm;Au 100nm);
-
Packing: silicon wafer case;
♦️ High-quality silicon wafer for Research and Experiment.
♦️ Provide small quantities, special specifications products, and customized services.
♦️Global shipping, secure payment, large inventory.
♦️Minimum delivery time within 1 week. Shipped by FedEx, DHL,UPS, etc.
Silicon Wafer Specification:
- Size: 4inch;
- Method: CZ;
- Type: N;
- Dopant: P;
- Orientation:100;
- Resistivity: <0.02Ω;
- Thickness: 500um±25;
- TTV<10um ;
- Surface: polished;
- Backside: etched;
- Gold film: 100nm (cr30nm;Au 100nm);
- Packing: silicon wafer case;
