Silicon wafer 4inch P/N Type 10~20Ω Oxide Layer Semiconductor Substrate
♦️High-quality silicon wafer for Research and Experiment.
♦️Provide small quantities, special specifications products, and customized services.
♦️Global shipping, secure payment, large inventory.
♦️Minimum delivery time within 1 week. Shipped by FedEx, DHL,UPS, etc.
Silicon Wafer Specification:
-
Size: 4inch;
-
Method: CZ;
-
Type: P;
-
Dopant: B;
-
Orientation:100;
-
Resistivity: 10~20Ω;
-
Thickness: 525um±25;
-
Oxide Layer: 300nm;
-
TTV<10um ;
-
Surface: polished;
-
Backside: etched;
-
Packing: silicon wafer case ;
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♦️High-quality silicon wafer for Research and Experiment.
♦️Provide small quantities, special specifications products, and customized services.
♦️Global shipping, secure payment, large inventory.
♦️Minimum delivery time within 1 week. Shipped by FedEx, DHL,UPS, etc.
Silicon Wafer Specification:
-
Size: 4inch;
-
Method: CZ;
-
Type: P;
-
Dopant: B;
-
Orientation:100;
-
Resistivity: 10~20Ω;
-
Thickness: 525um±25;
-
Oxide Layer: 300nm;
-
TTV<10um ;
-
Surface: polished;
-
Backside: etched;
-
Packing: silicon wafer case ;
♦️High-quality silicon wafer for Research and Experiment.
♦️Provide small quantities, special specifications products, and customized services.
♦️Global shipping, secure payment, large inventory.
♦️Minimum delivery time within 1 week. Shipped by FedEx, DHL,UPS, etc.
Silicon Wafer Specification:
-
Size: 4inch;
-
Method: CZ;
-
Type: P;
-
Dopant: B;
-
Orientation:100;
-
Resistivity: 10~20Ω;
-
Thickness: 525um±25;
-
Oxide Layer: 300nm;
-
TTV<10um ;
-
Surface: polished;
-
Backside: etched;
-
Packing: silicon wafer case ;
♦️High-quality silicon wafer for Research and Experiment.
♦️Provide small quantities, special specifications products, and customized services.
♦️Global shipping, secure payment, large inventory.
♦️Minimum delivery time within 1 week. Shipped by FedEx, DHL,UPS, etc.
Silicon Wafer Specification:
- Size: 4inch;
- Method: CZ;
- Type: P;
- Dopant: B;
- Orientation:100;
- Resistivity: 10~20Ω;
- Thickness: 525um±25;
- TTV<10um ;
- Surface: polished;
- Backside: etched;
- Oxide film: 300nm (both sides);
- Packing: silicon wafer case ;
