
Silicon wafer 2inch N Type(100/111) Single/Double Side Polished Semiconductor Substrate
♦️ High-quality silicon wafer for Research and Experiment.
♦️ Provide small quantities, special specifications products, and customized services.
♦️Global shipping, secure payment, large inventory.
♦️Minimum delivery time within 1 week. Shipped by FedEx, DHL,UPS, etc.
Silicon Wafer Specification:
Size: 2inch;
Method: CZ;
Type: N-Type ;
Dopant: As;
Orientation: 100;
Resistivity: 0.001~0.005Ω;
Thickness: 525um±25;
TTV<10um ;
Front side: polished;
Back side: etched;
Packing: silicon wafer case ;
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♦️ High-quality silicon wafer for Research and Experiment.
♦️ Provide small quantities, special specifications products, and customized services.
♦️Global shipping, secure payment, large inventory.
♦️Minimum delivery time within 1 week. Shipped by FedEx, DHL,UPS, etc.
Silicon Wafer Specification:
Size: 2inch;
Method: CZ;
Type: N-Type ;
Dopant: As;
Orientation: 100;
Resistivity: 0.001~0.005Ω;
Thickness: 525um±25;
TTV<10um ;
Front side: polished;
Back side: etched;
Packing: silicon wafer case ;
♦️ High-quality silicon wafer for Research and Experiment.
♦️ Provide small quantities, special specifications products, and customized services.
♦️Global shipping, secure payment, large inventory.
♦️Minimum delivery time within 1 week. Shipped by FedEx, DHL,UPS, etc.
Silicon Wafer Specification:
Size: 2inch;
Method: CZ;
Type: N-Type ;
Dopant: As;
Orientation: 100;
Resistivity: 0.001~0.005Ω;
Thickness: 525um±25;
TTV<10um ;
Front side: polished;
Back side: etched;
Packing: silicon wafer case ;
♦️ High-quality silicon wafer for Research and Experiment.
♦️ Provide small quantities, special specifications products, and customized services.
♦️Global shipping, secure payment, large inventory.
♦️Minimum delivery time within 1 week. Shipped by FedEx, DHL,UPS, etc.
Silicon Wafer Specification:
- Size: 2inch;
- Method: CZ;
- Type: P-Type ;
- Dopant: B;
- Orientation: 100;
- Resistivity: 0.01~0.05Ω;
- Thickness: 500um±25;
- TTV<10um ;
- Front side: polished;
- Back side: etched/polished;
- Packing: silicon wafer case ;
