SiC Wafer 12inch Dummy Grade N Type 4H Silicon Carbide Substrate IGBT
♦️High-quality SiC wafer for Research and Experiment.
♦️Global shipping, secure payment, large inventory.
♦️Production time 5~6 weeks. Shipped by FedEx, DHL,UPS, etc.
SiC Substrate Specification:
-
Size: 12inch;
-
Diameter: 300mm±0.5;
-
Thickness: 600um/700±100;
-
Surface Orientation: 4°toward[11-20]±1°;
-
Notch;
-
Micropipe: ≤ 5/cm2;
-
Resistivity: None;
-
TTV≤15um;
-
Surface Roughness: Si face Ra≤10 nm;
-
Edge chips: There is no chipping with a depth greater than 1mm;
-
Polytype Area by polarized light: Area≤30%;
-
Surface finish: C Face, Si Face Grinding;
-
Packing: Single Wafer Container;
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♦️High-quality SiC wafer for Research and Experiment.
♦️Global shipping, secure payment, large inventory.
♦️Production time 5~6 weeks. Shipped by FedEx, DHL,UPS, etc.
SiC Substrate Specification:
-
Size: 12inch;
-
Diameter: 300mm±0.5;
-
Thickness: 600um/700±100;
-
Surface Orientation: 4°toward[11-20]±1°;
-
Notch;
-
Micropipe: ≤ 5/cm2;
-
Resistivity: None;
-
TTV≤15um;
-
Surface Roughness: Si face Ra≤10 nm;
-
Edge chips: There is no chipping with a depth greater than 1mm;
-
Polytype Area by polarized light: Area≤30%;
-
Surface finish: C Face, Si Face Grinding;
-
Packing: Single Wafer Container;
♦️High-quality SiC wafer for Research and Experiment.
♦️Global shipping, secure payment, large inventory.
♦️Production time 5~6 weeks. Shipped by FedEx, DHL,UPS, etc.
SiC Substrate Specification:
-
Size: 12inch;
-
Diameter: 300mm±0.5;
-
Thickness: 600um/700±100;
-
Surface Orientation: 4°toward[11-20]±1°;
-
Notch;
-
Micropipe: ≤ 5/cm2;
-
Resistivity: None;
-
TTV≤15um;
-
Surface Roughness: Si face Ra≤10 nm;
-
Edge chips: There is no chipping with a depth greater than 1mm;
-
Polytype Area by polarized light: Area≤30%;
-
Surface finish: C Face, Si Face Grinding;
-
Packing: Single Wafer Container;
♦️High-quality SiC wafer for Research and Experiment.
♦️Provide small quantities, special specifications products, and customized services.
♦️Global shipping, secure payment, large inventory.
♦️Minimum delivery time within 1 week. Shipped by FedEx, DHL,UPS, etc.
SiC Substrate Specification:
- Size: 12inch;
- Diameter: 300mm±0.5;
- Thickness: 600 um±100;
- Surface Orientation: 4°toward[11-20]±1°;
- Notch;
- Micropipe: ≤ 5/cm2;
- Resistivity: None;
- TTV≤15um;
- Surface Roughness: Si face Ra≤10 nm;
- Edge chips: There is no chipping with a depth greater than 1mm;
- Polytype Area by polarized light: Area≤30%;
- Surface finish: C Face, Si Face Grinding;
- Packing: Multi-wafer Cassette Or Single Wafer Container;
