Silicon Wafer 12inch P Type 1-100Ω Oxide Layer Semiconductor Substrate
♦️ High-quality silicon wafer for Research and Experiment.
♦️ Provide small quantities, special specifications products, and customized services.
♦️Global shipping, secure payment, large inventory.
♦️Minimum delivery time within 1 week. Shipped by FedEx, DHL,UPS, etc.
Silicon Wafer Specification:
-
Size: 12inch;
-
Method: CZ;
-
Type: P;
-
Dopant: B;
-
Orientation:100;
-
Resistivity: 1~100Ω;
-
Thickness: 775um±25;
-
Oxide layer: 100nm (both sides);
-
Surface: polished;
-
Backside: polished;
-
Packing: silicon wafer case ;
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♦️ High-quality silicon wafer for Research and Experiment.
♦️ Provide small quantities, special specifications products, and customized services.
♦️Global shipping, secure payment, large inventory.
♦️Minimum delivery time within 1 week. Shipped by FedEx, DHL,UPS, etc.
Silicon Wafer Specification:
-
Size: 12inch;
-
Method: CZ;
-
Type: P;
-
Dopant: B;
-
Orientation:100;
-
Resistivity: 1~100Ω;
-
Thickness: 775um±25;
-
Oxide layer: 100nm (both sides);
-
Surface: polished;
-
Backside: polished;
-
Packing: silicon wafer case ;
♦️ High-quality silicon wafer for Research and Experiment.
♦️ Provide small quantities, special specifications products, and customized services.
♦️Global shipping, secure payment, large inventory.
♦️Minimum delivery time within 1 week. Shipped by FedEx, DHL,UPS, etc.
Silicon Wafer Specification:
-
Size: 12inch;
-
Method: CZ;
-
Type: P;
-
Dopant: B;
-
Orientation:100;
-
Resistivity: 1~100Ω;
-
Thickness: 775um±25;
-
Oxide layer: 100nm (both sides);
-
Surface: polished;
-
Backside: polished;
-
Packing: silicon wafer case ;
♦️ High-quality silicon wafer for Research and Experiment.
♦️ Provide small quantities, special specifications products, and customized services.
♦️Global shipping, secure payment, large inventory.
♦️Minimum delivery time within 1 week. Shipped by FedEx, DHL,UPS, etc.
Silicon Wafer Specification:
- Size: 12inch;
- Method: CZ;
- Type: P;
- Dopant: B;
- Orientation:100;
- Resistivity: 1~100Ω;
- Thickness: 775um±25;
- Oxide film: 100nm/300nm/500nm/1000nm (both sides);
- Surface: polished;
- Backside: polished;
- Packing: silicon wafer case ;
