Silicon carbide substrate wafer placed in a clear containing, showcasing its high-quality finish for research applications.
Three greenish-yellow spheres of varying sizes arranged in a triangular formation on a white background.

Silicon Carbide Substrate 4inch Dummy Grade 4H N Type SiC Wafer IGBT

$2,107.00
Grade:D Grade
Size:4inch
Quantity:8 Pieces
Menge:
♦️High-quality SiC wafer for Research and Experiment.
♦️Provide thinning process, thickness from 100um.
♦️Global shipping, secure payment, large inventory.
♦️Minimum delivery time within 1 week. Shipped by FedEx, DHL,UPS, etc.
SiC Substrate Specification:
  • Size: 4inch;
  • Poly type: N Type-4H;
  • Diameter: 99.5~100mm;
  • Thickness: 350um±25;
  • Surface Orientation 4°toward<11-20>±0.15º;
  • Primary flat orientation: [1-100]±5°;
  • Primary flat length: 32.5±1.5mm;
  • Secondary flat: 18±1.5mm;
  • Micropipe: ≤10ea/cm2;
  • TSD：None;
  • Resistivity: 0.015~0.028ohm·cm;
  • TTV≤15um
  • Warp≤50um;
  • Bow≤-45~45mmum;
  • Surface Roughness: Si face Ra＜0.2 nm(5*5mm);
  • Poly area: <30%(Cumulative area);
  • Scratches: NA;
  • Back defects: None;
  • Particels: NA;
  • Surface finish: Double Side Polish, Si Face CMP;
  • Packing: Multi-wafer Cassette Or Single Wafer Container;
♦️High-quality SiC wafer for Research and Experiment.
♦️Provide small quantities, special specifications products, and customized services.
♦️Global shipping, secure payment, large inventory.
♦️Minimum delivery time within 1 week. Shipped by FedEx, DHL,UPS, etc.
SiC Substrate Specification:
  • Size: 6inch;
  • Diameter: 150mm±0.25;
  • Thickness: 350um±25;
  • Surface Orientation: 4°toward[11-20]±5°;
  • Primary Flat orientation:[11-20]±5°;
  • Primary Flat Length:47.5mm±1.5;
  • Secondary flat: None;
  • Micropipe: ≤10/cm2;
  • Resistivity: 0.015~0.028Ω;
  • TTV≤10um;
  • Warp≤55um;
  • Bow≤45um;
  • Surface Roughness: Si face Ra＜0.5 nm;
  • Cracks: None;
  • Roughness: None;
  • Edge Chips: ≤2, the length and width of each ＜1mm;
  • Surface finish: Double Side Polish, Si Face CMP;
  • Packing: Multi-wafer Cassette Or Single Wafer Container;